超盈智能科技蛰伏存储行业13年,专注于产品封测和嵌入式存储解决方案,强劲的产品筛选能力对产品的来料有着严格的把控,产品稳定性得到高度保证。
型号 | 品牌 | 描述 | 库存 | 包装 | 交货地(工作日) | 操作 |
---|---|---|---|---|---|---|
M29W128FL70N6E | ST/意法 | 0 | 20 | 中国内地:1-2工作日 |
查看价格 |
规格参数 | |
---|---|
Part Life Cycle Code | Obsolete |
Memory Density | 134.2177Mbit |
Memory Width | 16 |
Sector Size | 64K |
Organization | 8MX16 |
Supply Voltage-Nom (Vsup) | 3V |
Power Supplies | 3/3.3V |
Access Time-Max | 70ns |
Memory IC Type | FLASH |
Additional Feature | 100,000PROGRAM/ERASECYCLES |
Alternate Memory Width | 8 |
Command User Interface | YES |
Common Flash Interface | YES |
Data Polling | YES |
Number of Functions | 1 |
Number of Sectors/Size | 256 |
Number of Words Code | 8000000 |
Number of Words | 8.3886M |
Operating Mode | ASYNCHRONOUS |
Page Size | 8/16words |
Parallel/Serial | PARALLEL |
Programming Voltage | 3V |
Ready/Busy | YES |
Standby Current-Max | 100µA |
Supply Current-Max | 20µA |
Supply Voltage-Max (Vsup) | 3.6V |
Supply Voltage-Min (Vsup) | 2.7V |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Toggle Bit | YES |
Type | NORTYPE |
JESD-30 Code | R-PDSO-G56 |
Qualification Status | NotQualified |
JESD-609 Code | e3/e6 |
Operating Temperature-Max | 85°C |
Operating Temperature-Min | -40°C |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Number of Terminals | 56 |
Package Body Material | PLASTIC/EPOXY |
Package Code | TSOP1 |
Package Equivalence Code | TSSOP56,.8,20 |
Package Shape | RECTANGULAR |
Package Style | SMALLOUTLINE,THINPROFILE |
Surface Mount | YES |
Terminal Finish | MATTETIN/TINBISMUTH |
Terminal Form | GULLWING |
Terminal Pitch | 500µm |
Terminal Position | DUAL |
Seated Height-Max | 1.2mm |
Length | 18.4mm |
Width | 14mm |
Source Content uid | M29W128FL70N6E |
Ihs Manufacturer | STMICROELECTRONICS |
Part Package Code | TSOP |
Package Description | 14X20MM,LEADFREE,PLASTIC,TSOP-56 |
Pin Count | 56 |
Reach Compliance Code | compliant |
ECCN Code | EAR99 |
HTS Code | 8542.32.00.51 |
超盈智能科技蛰伏存储行业13年,专注于产品封测和嵌入式存储解决方案,强劲的产品筛选能力对产品的来料有着严格的把控,产品稳定性得到高度保证。
根据最新数据显示,今年美国在芯片制造上的投资支出已经超过了过去27年的总和。
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